Faraday goes beyond technology by offering flexible business models tailored to each customer’s unique 2.5D/3D package project needs. Positioned neutrally and strategically, Faraday enhances flexibility and efficiency in advanced package service for multi-source chiplets, packaging, and manufacturing. In a long-term partnership with leading semiconductor foundry UMC and premier OSAT vendors in Taiwan, Faraday is capable of supporting custom passive/active interposer manufacturing with TSV, and proficiently managing 2.5D/3D package logistics.
Furthermore, Faraday deeps dive into package feasibility studies of chiplets and interposer based on the die information including die size, TSV, bump pitch and count, floorplan, substrate, power analysis, and thermal simulation. This comprehensive analysis not only comes up with an optimal package structure for each project in the early stage but also increases the success probability of the advanced package.
“Faraday empowers customers to redefine the possibilities of chip integration,” said Flash Lin, COO of Faraday. “Leveraging our SoC design expertise and backed by a 30-year experience of sustainable supply chain management, we are committed to production quality bearing in mind the exacting demands of the advanced package market.”
About Faraday Technology Corporation
Faraday Technology Corporation (TWSE: 3035) is a leading ASIC design service and IP provider, certificated to ISO 9001 and ISO 26262. The broad silicon IP portfolio includes I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, LPDDR4/4X, DDR4/3, MIPI D-PHY, V-by-One, USB 3.1/2.0, 10/100 Ethernet, Giga Ethernet, SATA3/2, PCIe Gen4/3, and 28G programmable SerDes, etc. Headquartered in Taiwan, Faraday has service and support offices around the world, including the U.S., Japan, and China. For more information, visit www.faraday-tech.com or follow Faraday on LinkedIn.
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